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3DV 2019 - International Conference on 3D Vision

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发表于 2019-3-14 11:57:59 | 显示全部楼层 |阅读模式
We invite submissions for the 7th international conference on 3D Vision, which will be held in Quebec City, Canada, on September 16-19, 2019. Since 2013, under the name 3DV, this event has provided a premier platform for disseminating research results covering a broad variety of topics in the area of 3D research in computer vision and graphics, from novel optical sensors, signal processing, geometric modelling, representation and transmission, to visualisation and interaction, and a variety of applications. Topics of interest include, but are not limited to:

ACQUISITION
Geometry
Calibration
Photometric stereo and shape from X
Photogrammetry
Structure from motion and SLAM
Dense reconstruction and stereo
Structured light and TOF sensors
Computational photography

MODELLING
Geometry processing
Appearance modelling
Registration and reconstruction
Shape representation and features
Generative and morphable models

ANALYSIS
Shape recognition
Shape retrieval
Shape analysis
Segmentation
Motion analysis
Tracking
Body, face and gesture
Medical

RENDERING AND INTERACTION
Image-based rendering
Applied perception
Augmented and mixed reality
Human-computer interaction

APPLICATIONS
Robotics
Cultural heritage
Industrial
Entertainment
Digital fabrication
Performance capture

GENERAL CHAIR
Denis Laurendeau, Université Laval, Canada

PROGRAM CHAIRS
Philippos Mordohai, Stevens Institute of Technology, USA
Ryusuke Sagawa, National Institute of Advanced Industrial Science and Technology, Japan
Federico Tombari, TU Munich, Germany
Stefanie Wuhrer, INRIA Grenoble, France

AREA CHAIR
Jonathan Boisvert, National Research Council of Canada
Michael Bronstein, Universita della Svizzera Italiana
Kosta Derpanis, Ryerson University
Enrique Dunn, Stevens Institute of Technology
Ryo Furukawa, Hiroshima City University
Mohit Gupta, University of Wisconsin-Madison
Adrian Hilton, University of Surrey
Jana Kosecka, George Mason University
Zuzana Kukelova, Czech Technical University Prague
Vincent Lepetit, University of Bordeaux
Hao Li, University of Southern California
Maks Ovsjanikov        Ecole Polytechnique France
Gerard Pons-Moll, Max Planck Institute for Intelligent Systems
Emanuele Rodola, Universitá La Sapienza
Torsten Sattler, Chalmers University of Technology
Michael Wand, Universitat Mainz
Yusuke Yoshiyasu, National Institute of Advanced Industrial Science and Technology - Tsukuba

IMPORTANT DATES
Paper submission: June 10, 2019
Paper notification: July 29, 2019
Paper camera ready: August 16, 2019

Accepted papers will be published by Conference Publishing Services (CPS) and submitted to IEEE Xplore and CSDL. For more information please visit: www.3dv.org.

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